"Celebrating our 10th year in operation in Low Alpha Materials"

Flip chip, area array and chip-scale packaging technology are fundamental in the paradigm shift from wire bonded devices to semiconductors offering an expanded, but more dense electrical circuitry, a smaller footprint, a reduced size and weight, lower electrical voltage and improved thermal capabilities.

This technology will require more circuitry in smaller, faster chips that cannot be produced given the limitations in circuit connections using wire bonding applications. High performance multi-layer chips employ a direct attachment through solder balls (ball grid arrays) to the printed circuit board or other platform(i.e. flip chip) in a controlled collapse connection chip (i.e. C-4) configuration. This direct attach technology allows greater flexibility in semiconductor construction as well as the other attributes noted above.

Pure Technologies' Alpha-Lo™ products are created through a proprietary, efficient separation manufacturing process employed at critical intervals in the manufacturing process.

For over two decades the semiconductor industry has been aware that the material most prominent in electronic devices, lead (Pb), had radioactive properties that at some point could upset the operational reliability of semiconductors.

With the present development of ASIC and other microprocessor circuitry, alpha emissions from some lead-free alloys, some polymers and lead are now an issue. Lead (Pb) is a derivative element of uranium. It is therefore obvious that lead contains some trace amounts of radioactive atoms. These trace amounts of radioactivity, in particular-alpha particles, are periodically and randomly released from lead. Although these released particles decrease over time and reach "secular equilibrium", alpha particle emissions will linger if not removed.

Lead-free solders may be alpha-contaminated!

Pure Technologies insures alpha emitter quality in all of its Alpha-Lo™ lead-free products.