The Objective:
More density on the integrated circuit (IC)
package.
The Challenge:
Reliability and functionality of the chip.
The Solution:
Low alpha materials for plating solutions, screen
printing and solder ball placement.
Pure Technologies offers Alpha Lo® products in every metal, alloy, purity and with alpha counts as low as <0.001 cph/cm2
Come See Us At:
March 9-10 2010
Visit us at the IMAPS "Device Packaging" Exhibition and Conference - March 9-10 2010 Booth #38 Radisson Fort McDowell Resort & Casino Scottsdale (Phoenix), Arizona
June 2-3 2010
Visit us at the ECTC Conference & Exhibition Paris Hotel, Las Vegas, Nevada June 2-3 2010 Booth #210
Pure Technologies
177 US Hwy # 1
# 306
Tequesta, FL 33469-2737
Ph. +1-561-743-4747 Fax: +1-877-738-8263
"Celebrating our 12th year specializing in supplying Low Alpha Materials"
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